NSC Technologies in Daily Life
Overview of Business
Slimming Process

Slimming ProcessNSC, being a pioneer in the slimming of LCD panel substrates, has contributed to making mobile devices including smartphones, tablets, and notebook computers thinner and lighter than ever before.

Single Substrate Spray Slimming

Single Substrate Spray SlimmingNSC's single substrate spray slimming process has enabled the volume production of large slimmed substrates with a size of up to G6, which has led to epoch-making advances in making smartphones and other mobile devices thinner and lighter.

Ultra-Thin Slimming

Ultra-Thin SlimmingWhile the demand for slimmed glass substrates and LCDs continues to increase in a wide range of fields, NSC has achieved an ultra-thin spray slimming process capable of attaining a thickness of only 50 μmt.

Light Etching

Light EtchingLight etching performs minute spray slimming in the micron order to remove "micro-cracks (minute flaws invisible to the human eye)", to prevent cracking and breaking and increase the strength of the glass.

Dimple Suppression Process

Dimple Suppression ProcessThe dimple suppression process suppresses the expansion of dimples that grow from flaws and micro-cracks to make the glass difficult to break.

Recycling Process

Recycling ProcessThe film removal process allows users to reuse dummy substrates and failed substrates, which were previously discarded, as dummy glass substrates to be filmed by recycling them to glass substrates before treatment.

Chemical Cut / Design Process

Chemical Cut / Design ProcessThe Chemical Cut / Design Process extracts a glass sheet of a specified shape using chemical technologies. This process can produce complex designs which would be difficult to produce with machine cutting while maintaining the transparency and high-class feeling that is unique to glass.

Cutting Process

Cutting ProcessThe chemical spot-facing process can engrave multiple glass substrates according to specified locations, shapes, and depths. This process offers the advantage of a flawless, smooth, and transparent finish.

AG (Anti-Glare) ProcessFunctional Process

AG (Anti-Glare) ProcessFunctional ProcessWith NSC's unique chemical technologies, the AG process can be performed directly on glass to improve the surface strength and durability of the AG effects.

Hole processing(TGV)

Hole processing(TGV)For application to 2.5D interposers, 3D Packaging, semiconductor devices and so on, NSC's unique chemical etching technology enables fine drilling of diameters φ20μm to φ200μm on large format glass substrates of 730x920mm. In addition, it is possible to correspond to the drilling process of mm order up to about φ10 mm.

Metal Etching

Metal EtchingNSC offers a metal etching process combining etching technologies (that are one of NSC’s strengths) with patterning processes for which NSC has unique know-how.

Waste Treatment/Resource Collection

Waste Treatment/Resource Collection NSC treats water containing spray slimming waste using the know-how accumulated since our foundation and strives to establish waste recycling technologies and technologies for recovering valuable materials from waste.

Purification of Carbon Material, Natural graphite

Purification of Carbon Material, Natural graphiteBy utilizing the LCD glass chemical slimming technology expertise, NSC contributes providing high purified natural graphite material for graphite sheet, carbon brush, secondary battery anode material, conductive agent and such.